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MP2363 – 3A, 27V, 365KHz STEP-DOWN CONVERTER
NOTICE:
The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
MP2363 Rev. 1.0
6/15/2006
www.MonolithicPower.com
11
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
2006 MPS. All Rights Reserved.
PACKAGE INFORMATION
SOIC8N (EXPOSED PAD)
NOTE:
1) Control dimension is in inches. Dimension in bracket is millimeters.
2) Exposed Pad Option (N-Package) ; 2.31mm -2.79mm x 2.79mm - 3.81mm.
Recommend Solder Board Area: 2.80mm x 3.82mm = 10.7mm
2
(16.6 mil
2
)
3) The length of the package does not include mold flash. Mold flash shall not exceed 0.006in. (0.15mm) per side.
With the mold flash included, over-all length of the package is 0.2087in. (5.3mm) max.
4) The width of the package does not include mold flash. Mold flash shall not exceed 0.10in. (0.25mm) per side.
With the mold flash included, over-all width of the package is 0.177in. (4.5mm) max.
0.016(0.410)
0.050(1.270)
0
o
-8
o
DETAIL "A"
0.011(0.280)
0.020(0.508)
x 45
o
SEE DETAIL "A"
0.0075(0.191)
0.0098(0.249)
0.229(5.820)
0.244(6.200)
Land Pattern
.028
.050
0.140 (3.55mm)
0.200 (5.07 mm)
0.060
0.150(3.810)
0.157(4.000)
PIN 1 IDENT.
0.050(1.270)BSC
0.013(0.330)
0.020(0.508)
NOTE 2
NOTE 4
SEATING PLANE
0.001(0.030)
0.004(0.101)
0.189(4.800)
0.197(5.000)
0.053(1.350)
0.068(1.730)
0.049(1.250)
0.060(1.524)
NOTE 3
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